Product Overview
ANC Korea manufactures a comprehensive range of surface treatment additives for electronic components. Our core products include tin plating additives for ceramic chips such as MLCC, CR, CI, and Varistor components, as well as specialized additives for lead frames, connectors, and lead wires. These solutions deliver exceptional electrical performance and long-term reliability.
Key Advantages
- Superior Electrical Performance: Delivers outstanding electrical characteristics while maintaining component integrity - original properties remain unchanged after plating
- Versatile Operating Range: Achieves consistent results across various conditions with wide pH and metal concentration operating parameters
- Uniform Surface Finish: Produces consistent semi-bright or bright surfaces, enhancing both appearance and functional performance
- Exceptional Soldering Properties: Creates smooth, soft crystal structures that provide excellent soldering performance with no discoloration or degradation over time
Product Portfolio
Pre-treatment Solutions
(7 Products)Surface Preparation and Activation
AC-006
Sulfuric acid-based degreasing solution. Effectively removes oxides and oils from material surfaces with no foam generation.
AC-007
Mild acid-based degreasing solution. Low-foam formulation effectively removes oxides and oils from material surfaces.
AC-009
Sulfuric acid-based degreasing solution. Features high wettability and low foam while effectively removing oxides and oils from material surfaces.
DF-100
Electrolytic mold flash remover designed for lead frames. Provides simultaneous electrolytic degreasing capabilities.
ES-100
Specialized descaling solution for copper alloy materials.
DS-420
Specialized descaling solution for Alloy 42 materials.
CU ETCH 100
High-performance etchant for copper materials.
Plating Solutions
(12 Products)Tin Plating Systems
AK-500 Series
Mildly acidic tin plating additive for MLCC, CR, CI, Varistor and other ceramic chips. Delivers uniform semi-bright finish with mildly acidic plating solution. Features wide pH and metal concentration operating range with reliable plating quality and no electrical characteristic changes.
AK-1700 Series
Mildly acidic low-foam tin plating additive specifically designed for MLCC chips. Minimizes external electrode damage while providing excellent uniform deposition and leveling. Dense structure ensures outstanding solderability and reliable plating quality. Low-foam formulation enables easy operation.
LSN-101 Series
Neutral tin plating additive specifically designed for inductor chips. Neutral formulation reduces inductor chip corrosion while providing excellent uniform deposition and solderability for reliable plating quality.
TS-200 Series
Neutral tin plating additive for CI, Varistor and other components. Delivers uniform semi-bright finish with neutral plating solution. Features wide metal concentration operating range with reliable plating quality and no electrical characteristic changes.
HM-30
(Pure Tin/Matte)
(Pure Tin/Matte)
Pure tin plating additive for lead frames, connectors, and lead wires. Produces smooth matte plating surface at high current density. Crystal structure is smooth and soft, providing excellent solderability with no discoloration or heat treatment issues over time.
HM-50
(Pure Tin/Matte)
(Pure Tin/Matte)
Pure tin plating additive for lead frames, connectors, and lead wires. Operates effectively at high current density, suitable for high-temperature applications, and produces smooth matte plating surface.
BH-501 Series
(Pure Tin/Bright)
(Pure Tin/Bright)
Pure tin bright plating additive for connectors. Delivers uniform bright plating in reel-to-reel processes and is also compatible with rack plating processes.
SA-10
(Pure Tin/Matte)
(Pure Tin/Matte)
Pure tin matte plating additive for connectors. Features wide operating current density range suitable for rack and barrel plating processes with smooth plating surface and excellent solderability.
PF-500
(Sn/Bi/Matte)
(Sn/Bi/Matte)
Sn/Bi alloy plating additive for lead frames. Enables high-speed operation with bright, uniform matte plating appearance and stable alloy composition ratio. Plating film delivers excellent soldering characteristics, heat resistance, and moisture resistance.
SN-1
(Pure/Bright/Stannous Sulfate Base)
(Pure/Bright/Stannous Sulfate Base)
Bright tin plating additive using stannous sulfate (SnSO₄). Compatible with rack and barrel plating processes, delivers consistent bright appearance with excellent soldering, thermal resistance, and adhesion properties, making it ideal for tin bright plating of most electronic products.
Nickel Plating Systems
NI-MAX Series
Nickel sulfate plating additive for electronic components. Ultra-high speed, high brightness, high leveling formulation with wide current density range plating capability.
NI-700
Nickel sulfamate plating additive for electronic components. Produces matte plating film with low stress and excellent ductility.
Post-treatment Solutions
(3 Products)Anti-tarnish Treatment
TIN-1
Tin anti-tarnish solution. Simple immersion treatment prevents staining or discoloration of plating surfaces and inhibits solderability degradation over time.
AT-2000
Copper anti-tarnish solution. Simple immersion treatment prevents staining or discoloration of plating surfaces.
AU-T
Gold sealing treatment and silver anti-tarnish solution. Short-time immersion treatment prevents gold or silver discoloration without degrading soldering or electrical resistance after treatment, making it ideal for electronic components such as connectors.