Overview
ANC Korea delivers comprehensive semiconductor surface treatment solutions including specialized electroplating additives for wafer bump filling, strippers, and etchants. Our products ensure exceptional deposition characteristics and consistent plating quality to meet the demanding requirements of semiconductor manufacturing.
Key Advantages
- High-Speed Plating Technology: Enables operation at elevated current densities compared to conventional solutions, significantly enhancing productivity
- Superior Deposition Uniformity: Delivers consistent plating quality with uniform deposition optimized for wafer bump filling applications
- Stable Alloy Composition Control: Ensures enhanced reliability through precise alloy composition and consistent bump thickness
Product Portfolio
Electroplating Solutions
(1 Product)Wafer Bump Plating
MTS-60
(Sn/Ag)
(Sn/Ag)
Advanced tin/silver additive for semiconductor wafer bump filling. Provides uniform alloy composition below 3% Ag content and maintains stable bump thickness for reliable interconnect performance.
Rework Strippers
(1 Product)Selective Metal Removal
AU STRIP-100
Specialized rework stripper for gold layer removal. Designed to address defective gold plating issues in semiconductor wafer processing while maintaining substrate integrity.
Etching Solutions
(1 Product)Precision Metal Etching
AU ETCH-1000
High-performance gold etchant for semiconductor wafer processing. Provides controlled etching rates and excellent selectivity for precise pattern definition.