Product Introduction
ANC Korea's PCB product line provides various additives and solutions to ensure optimal performance and quality in PCB manufacturing processes. We offer comprehensive solutions covering the entire process from desmear to electrolytic copper plating.
Key Features
- High-Quality Surface Treatment Solutions: Provides excellent plating quality and stable performance that meets the high quality standards required in the electronics industry
- Stable Process Management: Wide operating range and excellent stability maintain consistent quality under various conditions
- Excellent Adhesion: Uniform etching forms fine surface roughness, improving adhesion of plating layers
- Environmentally Friendly Products: Development of eco-friendly products that minimize environmental impact
Product Categories
DESMEAR
(3 Products)Epoxy Residue Removal and Surface Treatment
SWELLER-100
Epoxy residue remover for holes in multilayer PCBs. Swelling agent that creates activated hole interior surfaces to maximize electroless copper plating adhesion on epoxy and glass fiber.
DESMEAR-A/B
(Epoxy Etchant)
(Epoxy Etchant)
Removes softened epoxy smear to enhance electroless copper adhesion.
NEUTRALIZER-300
Neutralizes permanganate residues inside holes after Epoxy Etchant treatment, providing clean surfaces.
Electroless Copper Plating
(7 Products)Pretreatment and Surface Activation
CLEANER-902
Alkaline degreaser/conditioner for electroless copper plating. Composed of wetting agents and surfactants designed to change surface activity of non-conductive materials. Removes surface oxides and oils to help promote Pd catalyst adsorption through subsequent surface activation.
ME-110
Mildly acidic soft etchant. Etching speed can be controlled through temperature and concentration adjustment. Uniform etching forms fine copper surface roughness to increase adhesion.
ETCH-770
Sulfuric acid/hydrogen peroxide micro-etchant. Not only removes oxide films from copper surfaces but also forms fine copper surface roughness through uniform etching to increase adhesion. Excellent stability, enables room temperature operation with superior etching capacity and speed.
Catalyst Activation and Reduction
PD-101
Removes oxide films formed during processes after soft etching and provides wettability to facilitate Pd catalyst adsorption.
CAT-1000
(Ion Type Catalyst)
(Ion Type Catalyst)
Alkaline-type ion catalyst (Activator) that adsorbs Pd onto plating surfaces. Used directly after the previous PD-101 process without rinsing.
RD-201
Reduces ion-adsorbed Pd catalyst to metallic Pd.
Electroless Copper Plating
CU-100 Series
Low Build electroless copper plating solution. Provides consistent thickness of 0.3~0.5μm with bright and dense surfaces, offering excellent solution stability.
Copper Plating (Electrolytic)
(2 Products)Electrolytic Copper Plating
PC-500
High-brightness electrolytic copper plating additive. Provides excellent uniform deposition and superior bright appearance with low stress and good ductility for easy polishing. Suitable for plating requiring thick copper layers.
PC-900
Bright electrolytic copper plating additive. Provides fine and excellent leveling with uniform and bright appearance. Low stress and good ductility enable easy polishing and are suitable for plating requiring thick copper layers.
Surface Finishing & Special Plating
(4 Products)Post-treatment
AT-660
Water-soluble anti-corrosion agent effective for copper and copper alloys. Applicable to processes after electroless copper.
Special Catalyst
CAT-50
Colloidal type Pd catalyst. High concentration product with 6.7g/Lt palladium chloride offering excellent stability.
Electroless Tin Plating
ET-50
High build displacement-type electroless tin plating solution. Suitable for fine circuits of copper and copper alloy materials. Uniform and dense plating surface provides excellent solderability and adhesion, suitable for surface mount technology (SMT) soldering applications. Fast plating speed offers excellent workability.
Rack Stripper
KH-70 Series
Copper stripper. Designed to remove copper plated on racks and other jigs. Additive with excellent hydrogen peroxide stability even at high copper concentrations, with analytical management capability.