Product Overview
ANC Korea's PCB product line delivers comprehensive additives and solutions designed to ensure optimal performance and quality throughout PCB manufacturing processes. We provide end-to-end solutions covering the complete process chain from desmear operations to electrolytic copper plating.
Key Advantages
- Superior Surface Treatment Solutions: Delivers exceptional plating quality and consistent performance that meets the stringent quality standards required in the electronics industry
- Robust Process Control: Wide operating parameters and excellent stability ensure consistent quality across varying process conditions
- Outstanding Adhesion: Uniform etching creates optimal surface roughness, significantly improving adhesion of subsequent plating layers
- Environmental Responsibility: Development of eco-friendly formulations that minimize environmental impact while maintaining superior performance
Product Portfolio
Desmear Solutions
(3 Products)Epoxy Residue Removal and Surface Preparation
SWELLER-100
Epoxy residue removal system for multilayer PCB holes. Swelling agent that creates activated hole interior surfaces to maximize electroless copper plating adhesion on epoxy and glass fiber substrates.
DESMEAR-A/B
(Epoxy Etchant)
(Epoxy Etchant)
Removes softened epoxy smear to enhance electroless copper adhesion and ensure optimal plating quality.
NEUTRALIZER-300
Neutralizes permanganate residues inside holes after epoxy etchant treatment, providing clean, residue-free surfaces for subsequent processing.
Electroless Copper Plating Systems
(7 Products)Surface Preparation and Activation
CLEANER-902
Alkaline degreasing/conditioning solution for electroless copper plating. Formulated with wetting agents and surfactants designed to modify surface activity of non-conductive materials. Removes surface oxides and oils to promote Pd catalyst adsorption through subsequent surface activation.
ME-110
Mildly acidic soft etchant with controllable etching rate through temperature and concentration adjustment. Uniform etching creates optimal copper surface roughness to enhance adhesion properties.
ETCH-770
Sulfuric acid/hydrogen peroxide micro-etchant. Removes oxide films from copper surfaces while creating optimal copper surface roughness through uniform etching to maximize adhesion. Excellent stability enables room temperature operation with superior etching capacity and processing speed.
Catalyst Activation and Reduction
PD-101
Removes oxide films formed during post-etching processes and provides enhanced wettability to facilitate Pd catalyst adsorption.
CAT-1000
(Ion Type Catalyst)
(Ion Type Catalyst)
Alkaline-type ion catalyst (Activator) that adsorbs Pd onto plating surfaces. Used directly after the PD-101 process without intermediate rinsing for optimal efficiency.
RD-201
Reduces ion-adsorbed Pd catalyst to metallic Pd, preparing surfaces for electroless copper deposition.
Electroless Copper Deposition
CU-100 Series
Low Build electroless copper plating solution. Delivers consistent thickness of 0.3~0.5μm with bright and dense surface finishes, offering exceptional solution stability and process reliability.
Electrolytic Copper Plating Systems
(2 Products)Electrolytic Copper Plating Solutions
PC-500
High-brightness electrolytic copper plating additive. Delivers excellent uniform deposition and superior bright appearance with low stress characteristics and good ductility for easy post-processing. Ideal for applications requiring substantial copper layer thickness.
PC-900
Bright electrolytic copper plating additive. Provides fine grain structure and excellent leveling with uniform and bright appearance. Low stress characteristics and good ductility enable easy polishing and are suitable for applications requiring thick copper layers.
Surface Finishing & Specialty Plating
(4 Products)Post-treatment Solutions
AT-660
Water-soluble anti-corrosion solution effective for copper and copper alloys. Compatible with post-electroless copper processes for enhanced surface protection.
Specialty Catalysts
CAT-50
Colloidal-type Pd catalyst. High-concentration formulation with 6.7g/L palladium chloride offering exceptional stability and performance consistency.
Electroless Tin Plating Systems
ET-50
High build displacement-type electroless tin plating solution. Designed for fine-pitch circuits on copper and copper alloy materials. Uniform and dense plating surface delivers excellent solderability and adhesion, ideal for surface mount technology (SMT) soldering applications. Rapid plating rate ensures excellent productivity.
Rack Stripping Solutions
KH-70 Series
Copper stripping solution designed for removing copper deposits from racks and process fixtures. Additive featuring excellent hydrogen peroxide stability even at high copper concentrations, with comprehensive analytical management capabilities.