ANC Korea is committed to improving our customers' quality of life and contributing to a better world through innovation. We deliver reliable products and services that customers can trust through continuous research and development excellence.
| Project Title | Research Objective | Project Period | Status |
|---|---|---|---|
| Development of 250℃ High-Temperature Antioxidants for Copper and Copper Alloys to Strengthen Next-Generation Power Semiconductor Competitiveness | Develop advanced high-temperature antioxidants for copper and copper alloys operating at 250℃ | 2024.07.01 ~ 2027.12.31 | Ongoing |
| Development of Erosion-Resistant Neutral Ni, Sn Plating Solutions for Passive Components and Plating Methods Using Them | Create erosion-resistant neutral nickel and tin plating solutions for passive component applications | 2022.04.01 ~ 2024.06.30 | Completed |
| Production Process Improvement According to Tank Type Changes for Surface Treatment Chemical Manufacturing | Optimize manufacturing processes based on equipment upgrades for surface treatment chemicals | 2021.09.30 ~ 2022.09.29 | Completed |
| Development of Erosion-Resistant Tin Plating Solution for High-Reliability Multilayer Ceramic Capacitors | Develop specialized tin plating solutions for automotive-grade multilayer ceramic capacitors | 2019.11.06 ~ 2021.11.05 | Completed |
| Development of Zn-Co-Mo Alloy Plating Solution for Cold-Rolled Steel Plates with Improved Corrosion Resistance | Create zinc-cobalt-molybdenum alloy plating solutions with enhanced corrosion protection for steel applications | 2018.10.30 ~ 2019.10.29 | Completed |
| Development of Semiconductor Processing Component Materials Using Environmentally Friendly Crack-Free Trivalent Chromium Plating Solution | Develop eco-friendly trivalent chromium plating solutions and crack-free processes for semiconductor equipment | 2017.09.20 ~ 2018.09.19 | Completed |
| Development of Crack-Free Plating Process in Diamond Tool Manufacturing and Localization of Plating Solution | Create specialized hexavalent chromium plating solutions and crack-free processes for diamond tool applications | 2015.10.12 ~ 2018.01.11 | Completed |
| Development of Sn/Ag Plating Solution for Flip-chip Solder Bump | Develop tin-silver alloy plating solutions for semiconductor flip-chip solder bump applications | 2013.06.01 ~ 2015.05.31 | Completed |
| Technology Area | Product Series |
|---|---|
| Electroless Nickel Plating | NPSX Series |
| PCB Acid Cleaner & Catalyst | CATALYST, AC Series |
| Sn/Pb Alloy Plating Additives | BH Series |
| Lead-Free Sn/Bi Alloy Plating Additives | PF500 Series |
| Weakly Acidic Chip Plating Additives | LSN10 Series |
| Lead-Free Pure Tin Plating Additives | HM Series, PT Series, SA Series |
| Non-Cyanide Electroless Gold Plating | NPU Series |
| Electroless Tin Plating Solutions | ET50 |
| Lead Frame Plating Pretreatment | DF Series |
| Tin Anti-Tarnish Solutions | TIN-1 |
| PCB Acid Copper Additives | PC Series |
| COF Seed Strippers | N90 Series |
| Gold/Silver Anti-Tarnish Solutions | AT Series |
| Patented Chip Neutral Pure Tin Additives | AK Series |
| Patented Non-Cyanide Silver for Electronics | ES Series |
| Patented Sn/Ag Additives for Wafer Processing | MTS Series |
| Item | Process Technology | Chemical Solution | Operating Conditions |
|---|---|---|---|
| 1 | Bright Copper Plating | PC-900B (Ultra-High Speed Bright Copper Plating) | Temp. 25℃ / 15ASD |
| 2 | Matte Copper Plating | PC-500B (Ultra-High Speed Matte Copper Plating) | Temp. 25℃ / 15ASD |
| 3 | Sn/Ag Plating Solution | MTS-60 | Temp. 50℃ / 10ASD |
| 4 | Gold Etching | AU-ETCH 100M | Room Temperature |
| 5 | Gold Stripping (Rework Process) | AU-STRIP 100 | Temp. 40℃ |
| 6 | Copper Etching | CU ETCH-100M | Room Temperature |
| 7 | Sn/Ag Stripping (Rework Process) | SN/AG #-1 | Room Temperature |
| 8 | Sn/Ag Tarnish Removal | AG CLEAN-100M | Room Temperature |
| 9 | Titanium Etching | TI ETCH-200M | Room Temperature |
| 10 | Ti/W Etching | TI/W ETCH-500M | Room Temperature |
| 11 | Ni/Cr Stripping | STRIP-300 | Room Temperature |
| 12 | Sn/Bi Alloy (43:57) | PF-500 | Temp. 25℃ / 10ASD |
| 13 | Sn/Pb Alloy (5:95) | PB-900M | Temp. 30℃ |
| 14 | Pb/Sn Alloy (95:5) Copper Etching | CU ETCH-500 | Room Temperature |
Patent No.: 10-2664806
Registration Date: May 3, 2024
Advanced tin plating solution technology specifically designed for multilayer ceramic capacitor applications
Patent No.: 10-2012731
Registration Date: August 14, 2019
Innovative hexavalent chromium plating solution with crack-free pulse electroplating methodology
Patent No.: 10-2012739
Registration Date: August 14, 2019
Environmentally friendly trivalent chromium plating solution with crack-free process technology
Patent No.: 10-1175062
Registration Date: August 13, 2012
Eco-friendly lead-free solder technology using tin-silver alloy plating methodology
Patent No.: 10-1115592
Registration Date: February 9, 2012
Environmentally safe non-cyanide silver plating solution with advanced layer formation techniques
Patent No.: 10-1012815
Registration Date: January 27, 2011
Specialized weakly acidic tin plating solution optimized for electronic component chip applications
